JPH0727638Y2 - 集積回路素子の冷却構造 - Google Patents

集積回路素子の冷却構造

Info

Publication number
JPH0727638Y2
JPH0727638Y2 JP1989061963U JP6196389U JPH0727638Y2 JP H0727638 Y2 JPH0727638 Y2 JP H0727638Y2 JP 1989061963 U JP1989061963 U JP 1989061963U JP 6196389 U JP6196389 U JP 6196389U JP H0727638 Y2 JPH0727638 Y2 JP H0727638Y2
Authority
JP
Japan
Prior art keywords
integrated circuit
circuit element
cooling structure
nozzle
cold air
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1989061963U
Other languages
English (en)
Japanese (ja)
Other versions
JPH032652U (en]
Inventor
光彦 仲田
治彦 山本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP1989061963U priority Critical patent/JPH0727638Y2/ja
Publication of JPH032652U publication Critical patent/JPH032652U/ja
Application granted granted Critical
Publication of JPH0727638Y2 publication Critical patent/JPH0727638Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP1989061963U 1989-05-30 1989-05-30 集積回路素子の冷却構造 Expired - Lifetime JPH0727638Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989061963U JPH0727638Y2 (ja) 1989-05-30 1989-05-30 集積回路素子の冷却構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989061963U JPH0727638Y2 (ja) 1989-05-30 1989-05-30 集積回路素子の冷却構造

Publications (2)

Publication Number Publication Date
JPH032652U JPH032652U (en]) 1991-01-11
JPH0727638Y2 true JPH0727638Y2 (ja) 1995-06-21

Family

ID=31590687

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989061963U Expired - Lifetime JPH0727638Y2 (ja) 1989-05-30 1989-05-30 集積回路素子の冷却構造

Country Status (1)

Country Link
JP (1) JPH0727638Y2 (en])

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011119395A (ja) * 2009-12-02 2011-06-16 Fujitsu Telecom Networks Ltd 電子部品の冷却構造

Also Published As

Publication number Publication date
JPH032652U (en]) 1991-01-11

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